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Copper Brazing – V54 (Metling Point : 1083℃)
It has high penetration, good heat resistance and shock resistance.
Reactivity to Hart Metal(Tunsten) is good.
Low cost and economic.
(Wire, Thin Film, Powder)
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Copper-Nickel-Manganese Brazing – V77-24N9 (Melting Point : 960℃)
It has good penetration and reactivity to Hard Metal(Tungsten).
Greater high-temperature strength than Silver brazing filler material.
Highest fusing temperature among Copper-Mn-Ni type brazing filler materials.(Wire, Thin Film, Powder)
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Copper-Nickel-Manganese Brazing
- V77-28N2 (Melting Point : 930℃)(Powder)
- V77-38N9 (Melting Point : 920℃)(Wire, Thin Film)
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Copper-Manganese Brazing – V77-30 (Melting Point : 880℃)
Lowest fusing point among Copper-Mn type brazing filler metal.
Good reactivity to hard metal(Tungsten)
Greater high-temperature strength than silver brazing filler metal. (Wire)
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Silver Brazing – V1008 (Melting Point: 780℃)
Perform brazing by Ni plating to hard metal(Tungsten).
Masking is needed where plating is impossible because Ni plating layer of brazing part is alloyed with brazing filler metal thus not peeled off.
In cases of putting buffer copper plate between hard metal and parental metal when performing brazing, silver brazing filler metal is recommended. (Wire, Thin Film, Powder)
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Silver Brazing(contain Ni-Mn) – V1008-2M (Melting Point : 800℃)
Hard metal / Tungsten Brazing is possible Without plating.
It is brazing filler metal developed by our company, and often used to brazing of Tungsten electrodes. (Wire, Thin Film)